Shenzhen Huatian Microelectronics Co., Ltd., founded in 2014, is a national high-tech enterprise specializing in third-generation semiconductor (SiC/GaN) technologies. Leveraging an IDM (Integrated Device Manufacturing) model—including the establishment of Yihongwei Power Semiconductor Co., Ltd. in 2023 in collaboration with Dexing Yifa Power Semiconductor—Huatian Micro has built a closed-loop ecosystem covering "Yihongwei for design and R&D, Yifa Power for wafer production, and Huatian Micro for packaging, testing, and sales." Its business spans the entire industry chain, from semiconductor materials and wafers to devices and modules. The company’s products are widely used in solar-storage-charging systems, UPS, industrial power supplies, AI servers, consumer electronics, and other fields, serving numerous global customers with a worldwide sales network.
Huatian Micro’s core R&D team consists of doctors and professors from prestigious institutions including the National University of Defense Technology, University of Electronic Science and Technology of China, Chinese Academy of Sciences, and City University of Hong Kong, bringing together top talent in the semiconductor industry. With dozens of national invention patents, the company leads innovation in terminal design, process manufacturing, and product development. It plans to establish a national R&D center and laboratory, and will progressively take a leading role in drafting and formulating domestic industry standards.
Adhering to the philosophy of "Aerospace Quality, Technological Innovation, Customer First, and Collaborative Ecosystem," Huatian Micro is committed to reshaping the future with a bold vision. By 2035, the company aims to become a global technology benchmark and leading enterprise in the third-generation semiconductor industry, driving the transition to an efficient, low-carbon society, advancing green manufacturing, reducing its carbon footprint by 50%, and pioneering the integration of the "Semiconductor + Dual-Carbon" industries.
